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    Ražotājs: ANTEC

    Antec 900 PC case ATX Full Big Tower, black


    €323,58 ar pvn

    Artikuls: ST10477415
    Preces kods: 0-761345-10272-8
    Ražotāja mājaslapa
    Garantija: 12 mēneši
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    Noliktava Piegāde Daudzums Cena
    LV

    Specifikācija
    manufacturerANTEC
    product groupPC casing
    product typeATX Big-Tower
    colourblack
    weight15000
    height of packaging (single piece)630
    width of packaging (single piece)320
    depth of packaging (single piece)700
    package weight (single piece)16.75
    gross weight16.75
    scope of delivery1x PC case
    height622
    width250
    depth547
    dimensions (hxwxd)547 x 250 x 622 mm
    3.5 slots4
    housing dimensions (l x w x h)547 x 250 x 622 mm
    mainboard compatibilityATX
    front connectorsPower supply, USB 3.0 x 2, Type C 10 Gbit/s x 1, headphone/microphone combo jack
    pci slots8
    fan front3
    fan back side1
    optional fans2
    number of integrated fans6
    2.5 slots5
    Description

    The Antec Nine Hundred was one of the most recognizable high-airflow cases of its time-known for its open design, aggressive cooling, and expandability that let builders push hardware harder than ever before. The new Antec 900 is a modern interpretation of that legacy.

    • Edge AI & Workstation Ready: Supports ATX, E-ATX, SSI-CEB, SSI-EEB and AMD Threadripper.
    • AI-Optimised GPU Support: Designed for multi-GPU/accelerator configurations, including AI-optimised GPUs such as NVIDIA RTX 6000 Ada, RTX A6000 and comparable compute cards.
    • GPU and accelerator support: Designed for professional accelerator cards and full-length, three-slot GPUs used in AI, computing applications and 8K-capable gaming.
    • Supports GPUs up to 495 mm in length and 160 mm in thickness: The spacious interior accommodates multi-accelerator layouts, blower computer cards, or mixed GPU and add-in card configurations.
    • Storage & data availability: The total of 9 drive bays are a direct reference to the storage flexibility of the original, now redesigned for AI data sets, scratch disks, project libraries and RAID.
    • Up to 9 drive bays: 5 x 2.5‘ and 4 x 3.5’ (or convertible for additional 2.5").
    • Powerful airflow design: Features an ultra-enclosure design for excellent airflow and offers improved GPU cooling performance.
    • Integrated fans for improved cooling performance: Equipped with 6 pre-installed high-performance fans, the 900 further optimises its airflow design to achieve more stable and superior overall cooling.
    • 6 pre-installed high-performance fans with PWM control: 3 x TQ140 high-performance fans with a diameter of 140 mm for front intake, 2 x PI2R fans with a diameter of 120 mm and reverse flow on the power supply cover to stabilise the airflow in the chamber, 1 x TQ140 fan with a diameter of 140 mm for rear exhaust.
    • Adjustable fan mount for different fan sizes: Supports 2 x 200 mm front fans for high airflow at low speeds in noise-sensitive environments.
    • Multidirectional ventilation design
    • Serious Cooling Headroom: Cooler mount: Up to 420 mm (<52 mm thick) at the front. Top up to 360 mm (<52 mm thickness).
    • INNOVATIVE ISHIFT power supply 90° mount
    • I/O panel: Equipped with a high-speed USB Type-C port with 10 Gbit/s.
    • Supports back-connect motherboards: Plug in cables from the rear to keep the front clean and achieve more consistent airflow.
    • 8 reusable PCIE slots: 8 expansion slots provide space for accelerators, capture cards, high-speed networking and storage controllers.
    • Tool-free panel design: 4 mm thick tempered glass side panel, tool-free for quick access.
    • Removable top cooling bracket: First attach the fans/coolers to the cooling bracket and then reattach the cooling bracket to the case.
    • Complete dust filtration at the front, top and bottom
    • Optimal cable routing


    Specifikācija
    manufacturerANTEC
    product groupPC casing
    product typeATX Big-Tower
    colourblack
    weight15000
    height of packaging (single piece)630
    width of packaging (single piece)320
    depth of packaging (single piece)700
    package weight (single piece)16.75
    gross weight16.75
    scope of delivery1x PC case
    height622
    width250
    depth547
    dimensions (hxwxd)547 x 250 x 622 mm
    3.5 slots4
    housing dimensions (l x w x h)547 x 250 x 622 mm
    mainboard compatibilityATX
    front connectorsPower supply, USB 3.0 x 2, Type C 10 Gbit/s x 1, headphone/microphone combo jack
    pci slots8
    fan front3
    fan back side1
    optional fans2
    number of integrated fans6
    2.5 slots5
    Description

    The Antec Nine Hundred was one of the most recognizable high-airflow cases of its time-known for its open design, aggressive cooling, and expandability that let builders push hardware harder than ever before. The new Antec 900 is a modern interpretation of that legacy.

    • Edge AI & Workstation Ready: Supports ATX, E-ATX, SSI-CEB, SSI-EEB and AMD Threadripper.
    • AI-Optimised GPU Support: Designed for multi-GPU/accelerator configurations, including AI-optimised GPUs such as NVIDIA RTX 6000 Ada, RTX A6000 and comparable compute cards.
    • GPU and accelerator support: Designed for professional accelerator cards and full-length, three-slot GPUs used in AI, computing applications and 8K-capable gaming.
    • Supports GPUs up to 495 mm in length and 160 mm in thickness: The spacious interior accommodates multi-accelerator layouts, blower computer cards, or mixed GPU and add-in card configurations.
    • Storage & data availability: The total of 9 drive bays are a direct reference to the storage flexibility of the original, now redesigned for AI data sets, scratch disks, project libraries and RAID.
    • Up to 9 drive bays: 5 x 2.5‘ and 4 x 3.5’ (or convertible for additional 2.5").
    • Powerful airflow design: Features an ultra-enclosure design for excellent airflow and offers improved GPU cooling performance.
    • Integrated fans for improved cooling performance: Equipped with 6 pre-installed high-performance fans, the 900 further optimises its airflow design to achieve more stable and superior overall cooling.
    • 6 pre-installed high-performance fans with PWM control: 3 x TQ140 high-performance fans with a diameter of 140 mm for front intake, 2 x PI2R fans with a diameter of 120 mm and reverse flow on the power supply cover to stabilise the airflow in the chamber, 1 x TQ140 fan with a diameter of 140 mm for rear exhaust.
    • Adjustable fan mount for different fan sizes: Supports 2 x 200 mm front fans for high airflow at low speeds in noise-sensitive environments.
    • Multidirectional ventilation design
    • Serious Cooling Headroom: Cooler mount: Up to 420 mm (<52 mm thick) at the front. Top up to 360 mm (<52 mm thickness).
    • INNOVATIVE ISHIFT power supply 90° mount
    • I/O panel: Equipped with a high-speed USB Type-C port with 10 Gbit/s.
    • Supports back-connect motherboards: Plug in cables from the rear to keep the front clean and achieve more consistent airflow.
    • 8 reusable PCIE slots: 8 expansion slots provide space for accelerators, capture cards, high-speed networking and storage controllers.
    • Tool-free panel design: 4 mm thick tempered glass side panel, tool-free for quick access.
    • Removable top cooling bracket: First attach the fans/coolers to the cooling bracket and then reattach the cooling bracket to the case.
    • Complete dust filtration at the front, top and bottom
    • Optimal cable routing