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    Производитель: INTEL

    Intel Core I3-12100F


    €103,09 с налогом

    Артикул: ST05199180
    Код производителя: BX8071512100F
    Сайт производителя
    гарантия: 12 месяцы
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    Склад Доставка Наличие Цена
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    PL
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    Характеристики
    Серия процессора Intel Core i3
    Разъём процессора (Socket) LGA 1700
    CPU code

    Core i3-12100 F

    Processor familyIntel Core i3
    CPU socketLGA1700
    CPU frequency3.3 (GHz)
    CPU Boost frequency4.3 (GHz)
    Number of cores4
    Number of threads8
    L2 cache5 MB
    L3 cache 12 MB
    ECC supportNo
    Architecture64-bit
    Extra coolingYes
    VersionBox
    Dimensions

    Wymiary opakowania: 105 x 79 x 121 mm

    DesignationCE+WEEE
    Width105
    Height120
    Depth80
    Weight453
    Description

    Procesor Core i3-12100 F BOX 3,3GHz, LGA1700

    Processor familyIntel® Core™ i3
    Processor cores4
    Processor socketLGA 1700
    BoxYes
    Processor manufacturerIntel
    Processor modeli3-12100F
    Processor operating modes64-bit
    Processor generation12th gen Intel® Core™ i3
    Processor threads8
    Performance cores4
    Processor boost frequency4.3 GHz
    Performance-core boost frequency4.3 GHz
    Performance-core base frequency3.3 GHz
    Processor cache12 MB
    Processor cache typeSmart Cache
    Processor base power58 W
    Maximum turbo power89 W
    Bus typeDMI4
    Maximum number of DMI lanes8
    Memory bandwidth supported by processor (max)76.8 GB/s
    Processor codenameAlder Lake
    Processor ARK ID132223
    Memory channelsDual-channel
    Maximum internal memory supported by processor128 GB
    Memory types supported by processorDDR4-SDRAM, DDR5-SDRAM
    Memory bandwidth (max)76.8 GB/s
    On-board graphics cardNo
    Discrete graphics cardNo
    On-board graphics card modelNot available
    Discrete graphics card modelNot available
    Execute Disable BitYes
    Idle StatesYes
    Thermal Monitoring TechnologiesYes
    Market segmentDesktop
    Use conditionsPC/Client/Tablet
    Maximum number of PCI Express lanes20
    PCI Express slots version4.0, 5.0
    PCI Express configurations1x16+1x4, 2x8+1x4
    Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
    Scalability1S
    CPU configuration (max)1
    Embedded options availableNo
    Direct Media Interface (DMI) Revision4.0
    Export Control Classification Number (ECCN)5A992CN3
    Commodity Classification Automated Tracking System (CCATS)G167599
    Intel® Hyper Threading Technology (Intel® HT Technology)Yes
    Intel® Turbo Boost Technology2.0
    Intel® AES New Instructions (Intel® AES-NI)Yes
    Enhanced Intel SpeedStep TechnologyYes
    Intel® Speed Shift TechnologyYes
    Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0Yes
    Intel® Control-flow Enforcement Technology (CET)Yes
    Intel® Thread DirectorNo
    Intel VT-x with Extended Page Tables (EPT)Yes
    Intel® Secure KeyYes
    Intel® OS GuardYes
    Intel 64Yes
    Intel Virtualization Technology (VT-x)Yes
    Intel Virtualization Technology for Directed I/O (VT-d)Yes
    Intel Turbo Boost Max Technology 3.0No
    Intel® Optane™ Memory ReadyYes
    Intel® Boot GuardYes
    Intel® Deep Learning Boost (Intel® DL Boost)Yes
    Intel® Volume Management Device (VMD)Yes
    Mode-based Execute Control (MBE)Yes
    Intel® Standard Manageability (ISM)Yes
    Tjunction100 °C
    Harmonized System (HS) code85423119
    Package typeRetail box
    Processor package size45 x 37.5 mm
    Maximum internal memory128 GB
    Launch dateQ1'22
    StatusLaunched
    Description
    Intel Core i3-12100F. Processor family: Intel® Core™ i3, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 4.0, 5.0. Package type: Retail box. Processor package size: 45 x 37.5 mm
    Description
    Procesoru saime: Intel Core i3, Kodola nosaukums: Alder Lake, Procesora modelis: 12100F, Ligzda: LGA 1700, Procesora pamata frekvence: 3.3 Ghz, Kodolu skaits: 4, Kešatmiņa: 12 MB, Procesora tehnoloģija: 10 nm, TDP: 60W, Integrēta video karte: Nav, Garantija: 2 gadi
    manufacturerINTEL
    product typeProcessors
    height0.110
    width0.080
    depth0.125
    Description

    Intel Core i3-12100F. Processor family: Intel® Core™ i3, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 4.0, 5.0. Package type: Retail box. Processor package size: 45 x 37.5 mm

    Intel® Virtualization Technology for Directed I/O (VT-d)
    Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

    Intel® Virtualization Technology (VT-x)
    Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

    Intel® 64
    Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

    Cache
    CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

    Intel® AES New Instructions
    Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

    Idle States
    Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

    Intel® Turbo Boost Technology
    Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

    Max Turbo Frequency
    Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

    Execute Disable Bit
    Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

    Intel® Hyper-Threading Technology
    Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

    Instruction Set
    An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

    Intel® VT-x with Extended Page Tables (EPT)
    Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

    Intel® Optane™ Memory Supported
    Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

    Enhanced Intel SpeedStep® Technology
    Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

    Secure Key
    Intel® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.

    Intel® Speed Shift Technology
    Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

    Intel® Deep Learning Boost (Intel® DL Boost) on CPU
    A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

    Instruction Set Extensions
    Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

    Intel® Turbo Boost Max Technology 3.0
    Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.

    Thermal Monitoring Technologies
    Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

    Intel® Volume Management Device (VMD)
    Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.

    Intel® Gaussian & Neural Accelerator
    Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speech-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.

    Mode-based Execute Control (MBEC)
    Mode-based Execute Control can more reliably verify and enforce the integrity of kernel level code.

    Intel® Boot Guard
    Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.

    Intel® Control-Flow Enforcement Technology
    CET - Intel Control-flow Enforcement Technology (CET) helps protect against the misuse of legitimate code snippets through return-oriented programming (ROP) control-flow hijacking attacks.


    DescriptionINTEL Core i3-12100F 3.3GHz LGA1700 Box
    VatTypeVAT
    Weight0.460000000
    Height80.000000000
    Width110.000000000
    Length125.000000000
    Description
    INTEL Core i3-12100F 3.3GHz LGA1700 12M Cache Boxed CPU
    Weight0.45
    Gross weight0.45
    Description
    • Generation: 12th Gen (Alder Lake)

    • Core Count: 4 (4 Performance cores)

    • Thread Count: 8

    • Base Frequency: 3.3 GHz

    • Max Turbo Frequency: 4.3 GHz

    • L3 Cache: 12 MB

    • L2 Cache: 5 MB

    • Manufacturing Technology: Intel 7 (10 nm)

    • Socket: LGA 1700

    • Supported Memory: DDR4 and DDR5 up to 128 GB

    • PCIe Support: PCIe 5.0 and 4.0

    • Integrated Graphics: None (requires discrete graphics card)

    • Included Cooler: Intel® Laminar RM1

    • TDP (Thermal Design Power): 58 W

    • Motherboard Compatibility: Intel® 600 series chipsets

    • Paaudze: 12. paaudze (Alder Lake)

    • Kodolu skaits: 4 (4 Performance kodoli)

    • Pavedienu skaits: 8

    • Bāzes frekvence: 3.3 GHz

    • Maksimālā Turbo frekvence: 4.3 GHz

    • L3 kešatmiņa: 12 MB

    • L2 kešatmiņa: 5 MB

    • Ražošanas tehnoloģija: Intel 7 (10 nm)

    • Sokets: LGA 1700

    • Atbalstītā atmiņa: DDR4 un DDR5 līdz 128 GB

    • PCIe atbalsts: PCIe 5.0 un 4.0

    • Iebūvēta grafika: Nav (prasa atsevišķu grafisko karti)

    • Iekļauts dzesētājs: Intel® Laminar RM1

    • TDP (Thermal Design Power): 58 W

    • Saderība ar mātesplatēm: Intel® 600 sērijas čipseti

    • Поколение: 12-е (Alder Lake)

    • Количество ядер: 4 (4 производительных ядра)

    • Количество потоков: 8

    • Базовая частота: 3.3 ГГц

    • Максимальная Turbo частота: 4.3 ГГц

    • Кэш L3: 12 МБ

    • Кэш L2: 5 МБ

    • Технология производства: Intel 7 (10 нм)

    • Сокет: LGA 1700

    • Поддерживаемая память: DDR4 и DDR5 до 128 ГБ

    • Поддержка PCIe: PCIe 5.0 и 4.0

    • Интегрированная графика: Отсутствует (требуется отдельная видеокарта)

    • Включённый кулер: Intel® Laminar RM1

    • TDP (Тепловая мощность): 58 Вт

    • Совместимость с материнскими платами: Чипсеты Intel® 600 серии

    DescriptionINTEL Core i3-12100F 3.3GHz LGA1700 Box
    VatTypeVAT
    Weight0.460000000
    Height80.000000000
    Width110.000000000
    Length125.000000000
    Description
    INTEL Core i3-12100F 3.3GHz LGA1700 12M Cache Boxed CPU
    Gross depth (mm)80
    Gross depth (mm)80
    Gross height (mm)120
    Gross height (mm)120
    Gross weight0.5
    Gross width (mm)105
    Gross width (mm)105
    Net weight0.356
    Tare weight (kg)0.14
    Tare weight (kg)0.14
    Volume (m3)0.001008
    Volume (m3)0.001008
    Gross depth master carton400
    Gross depth master carton400
    Gross width master carton130
    Gross width master carton130
    Gross height master carton120
    Gross height master carton120
    Net weight master carton2.5
    Net weight master carton2.5

    Характеристики
    Серия процессора Intel Core i3
    Разъём процессора (Socket) LGA 1700
    CPU code

    Core i3-12100 F

    Processor familyIntel Core i3
    CPU socketLGA1700
    CPU frequency3.3 (GHz)
    CPU Boost frequency4.3 (GHz)
    Number of cores4
    Number of threads8
    L2 cache5 MB
    L3 cache 12 MB
    ECC supportNo
    Architecture64-bit
    Extra coolingYes
    VersionBox
    Dimensions

    Wymiary opakowania: 105 x 79 x 121 mm

    DesignationCE+WEEE
    Width105
    Height120
    Depth80
    Weight453
    Description

    Procesor Core i3-12100 F BOX 3,3GHz, LGA1700

    Processor familyIntel® Core™ i3
    Processor cores4
    Processor socketLGA 1700
    BoxYes
    Processor manufacturerIntel
    Processor modeli3-12100F
    Processor operating modes64-bit
    Processor generation12th gen Intel® Core™ i3
    Processor threads8
    Performance cores4
    Processor boost frequency4.3 GHz
    Performance-core boost frequency4.3 GHz
    Performance-core base frequency3.3 GHz
    Processor cache12 MB
    Processor cache typeSmart Cache
    Processor base power58 W
    Maximum turbo power89 W
    Bus typeDMI4
    Maximum number of DMI lanes8
    Memory bandwidth supported by processor (max)76.8 GB/s
    Processor codenameAlder Lake
    Processor ARK ID132223
    Memory channelsDual-channel
    Maximum internal memory supported by processor128 GB
    Memory types supported by processorDDR4-SDRAM, DDR5-SDRAM
    Memory bandwidth (max)76.8 GB/s
    On-board graphics cardNo
    Discrete graphics cardNo
    On-board graphics card modelNot available
    Discrete graphics card modelNot available
    Execute Disable BitYes
    Idle StatesYes
    Thermal Monitoring TechnologiesYes
    Market segmentDesktop
    Use conditionsPC/Client/Tablet
    Maximum number of PCI Express lanes20
    PCI Express slots version4.0, 5.0
    PCI Express configurations1x16+1x4, 2x8+1x4
    Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
    Scalability1S
    CPU configuration (max)1
    Embedded options availableNo
    Direct Media Interface (DMI) Revision4.0
    Export Control Classification Number (ECCN)5A992CN3
    Commodity Classification Automated Tracking System (CCATS)G167599
    Intel® Hyper Threading Technology (Intel® HT Technology)Yes
    Intel® Turbo Boost Technology2.0
    Intel® AES New Instructions (Intel® AES-NI)Yes
    Enhanced Intel SpeedStep TechnologyYes
    Intel® Speed Shift TechnologyYes
    Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0Yes
    Intel® Control-flow Enforcement Technology (CET)Yes
    Intel® Thread DirectorNo
    Intel VT-x with Extended Page Tables (EPT)Yes
    Intel® Secure KeyYes
    Intel® OS GuardYes
    Intel 64Yes
    Intel Virtualization Technology (VT-x)Yes
    Intel Virtualization Technology for Directed I/O (VT-d)Yes
    Intel Turbo Boost Max Technology 3.0No
    Intel® Optane™ Memory ReadyYes
    Intel® Boot GuardYes
    Intel® Deep Learning Boost (Intel® DL Boost)Yes
    Intel® Volume Management Device (VMD)Yes
    Mode-based Execute Control (MBE)Yes
    Intel® Standard Manageability (ISM)Yes
    Tjunction100 °C
    Harmonized System (HS) code85423119
    Package typeRetail box
    Processor package size45 x 37.5 mm
    Maximum internal memory128 GB
    Launch dateQ1'22
    StatusLaunched
    Description
    Intel Core i3-12100F. Processor family: Intel® Core™ i3, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 4.0, 5.0. Package type: Retail box. Processor package size: 45 x 37.5 mm
    Description
    Procesoru saime: Intel Core i3, Kodola nosaukums: Alder Lake, Procesora modelis: 12100F, Ligzda: LGA 1700, Procesora pamata frekvence: 3.3 Ghz, Kodolu skaits: 4, Kešatmiņa: 12 MB, Procesora tehnoloģija: 10 nm, TDP: 60W, Integrēta video karte: Nav, Garantija: 2 gadi
    manufacturerINTEL
    product typeProcessors
    height0.110
    width0.080
    depth0.125
    Description

    Intel Core i3-12100F. Processor family: Intel® Core™ i3, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 4.0, 5.0. Package type: Retail box. Processor package size: 45 x 37.5 mm

    Intel® Virtualization Technology for Directed I/O (VT-d)
    Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

    Intel® Virtualization Technology (VT-x)
    Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

    Intel® 64
    Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

    Cache
    CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

    Intel® AES New Instructions
    Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

    Idle States
    Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

    Intel® Turbo Boost Technology
    Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

    Max Turbo Frequency
    Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

    Execute Disable Bit
    Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

    Intel® Hyper-Threading Technology
    Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

    Instruction Set
    An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

    Intel® VT-x with Extended Page Tables (EPT)
    Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

    Intel® Optane™ Memory Supported
    Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

    Enhanced Intel SpeedStep® Technology
    Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

    Secure Key
    Intel® Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.

    Intel® Speed Shift Technology
    Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

    Intel® Deep Learning Boost (Intel® DL Boost) on CPU
    A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

    Instruction Set Extensions
    Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

    Intel® Turbo Boost Max Technology 3.0
    Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.

    Thermal Monitoring Technologies
    Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

    Intel® Volume Management Device (VMD)
    Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.

    Intel® Gaussian & Neural Accelerator
    Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speech-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.

    Mode-based Execute Control (MBEC)
    Mode-based Execute Control can more reliably verify and enforce the integrity of kernel level code.

    Intel® Boot Guard
    Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.

    Intel® Control-Flow Enforcement Technology
    CET - Intel Control-flow Enforcement Technology (CET) helps protect against the misuse of legitimate code snippets through return-oriented programming (ROP) control-flow hijacking attacks.


    DescriptionINTEL Core i3-12100F 3.3GHz LGA1700 Box
    VatTypeVAT
    Weight0.460000000
    Height80.000000000
    Width110.000000000
    Length125.000000000
    Description
    INTEL Core i3-12100F 3.3GHz LGA1700 12M Cache Boxed CPU
    Weight0.45
    Gross weight0.45
    Description
    • Generation: 12th Gen (Alder Lake)

    • Core Count: 4 (4 Performance cores)

    • Thread Count: 8

    • Base Frequency: 3.3 GHz

    • Max Turbo Frequency: 4.3 GHz

    • L3 Cache: 12 MB

    • L2 Cache: 5 MB

    • Manufacturing Technology: Intel 7 (10 nm)

    • Socket: LGA 1700

    • Supported Memory: DDR4 and DDR5 up to 128 GB

    • PCIe Support: PCIe 5.0 and 4.0

    • Integrated Graphics: None (requires discrete graphics card)

    • Included Cooler: Intel® Laminar RM1

    • TDP (Thermal Design Power): 58 W

    • Motherboard Compatibility: Intel® 600 series chipsets

    • Paaudze: 12. paaudze (Alder Lake)

    • Kodolu skaits: 4 (4 Performance kodoli)

    • Pavedienu skaits: 8

    • Bāzes frekvence: 3.3 GHz

    • Maksimālā Turbo frekvence: 4.3 GHz

    • L3 kešatmiņa: 12 MB

    • L2 kešatmiņa: 5 MB

    • Ražošanas tehnoloģija: Intel 7 (10 nm)

    • Sokets: LGA 1700

    • Atbalstītā atmiņa: DDR4 un DDR5 līdz 128 GB

    • PCIe atbalsts: PCIe 5.0 un 4.0

    • Iebūvēta grafika: Nav (prasa atsevišķu grafisko karti)

    • Iekļauts dzesētājs: Intel® Laminar RM1

    • TDP (Thermal Design Power): 58 W

    • Saderība ar mātesplatēm: Intel® 600 sērijas čipseti

    • Поколение: 12-е (Alder Lake)

    • Количество ядер: 4 (4 производительных ядра)

    • Количество потоков: 8

    • Базовая частота: 3.3 ГГц

    • Максимальная Turbo частота: 4.3 ГГц

    • Кэш L3: 12 МБ

    • Кэш L2: 5 МБ

    • Технология производства: Intel 7 (10 нм)

    • Сокет: LGA 1700

    • Поддерживаемая память: DDR4 и DDR5 до 128 ГБ

    • Поддержка PCIe: PCIe 5.0 и 4.0

    • Интегрированная графика: Отсутствует (требуется отдельная видеокарта)

    • Включённый кулер: Intel® Laminar RM1

    • TDP (Тепловая мощность): 58 Вт

    • Совместимость с материнскими платами: Чипсеты Intel® 600 серии

    DescriptionINTEL Core i3-12100F 3.3GHz LGA1700 Box
    VatTypeVAT
    Weight0.460000000
    Height80.000000000
    Width110.000000000
    Length125.000000000
    Description
    INTEL Core i3-12100F 3.3GHz LGA1700 12M Cache Boxed CPU
    Gross depth (mm)80
    Gross depth (mm)80
    Gross height (mm)120
    Gross height (mm)120
    Gross weight0.5
    Gross width (mm)105
    Gross width (mm)105
    Net weight0.356
    Tare weight (kg)0.14
    Tare weight (kg)0.14
    Volume (m3)0.001008
    Volume (m3)0.001008
    Gross depth master carton400
    Gross depth master carton400
    Gross width master carton130
    Gross width master carton130
    Gross height master carton120
    Gross height master carton120
    Net weight master carton2.5
    Net weight master carton2.5
    Последние