| Processor family | Intel® Xeon® |
| Processor cores | 28 |
| Processor socket | LGA 3647 (Socket P) |
| Processor lithography | 14 nm |
| Box | Yes |
| Cooler included | Yes |
| Processor manufacturer | Intel |
| Processor model | W-3175X |
| Processor base frequency | 3.1 GHz |
| Processor operating modes | 64-bit |
| Component for | PC |
| Processor threads | 56 |
| System bus rate | 8 GT/s |
| Processor boost frequency | 3.8 GHz |
| Processor cache | 38.5 MB |
| Processor cache type | Smart Cache |
| Thermal Design Power (TDP) | 255 W |
| Bus type | DMI3 |
| Processor codename | Skylake |
| Processor ARK ID | 189452 |
| Memory channels | Hexa-channel |
| Maximum internal memory supported by processor | 512 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| ECC | Yes |
| On-board graphics card | No |
| Execute Disable Bit | Yes |
| Market segment | Desktop |
| Maximum number of PCI Express lanes | 48 |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 1S |
| CPU configuration (max) | 1 |
| Embedded options available | No |
| PCI Express CEM revision | 3.0 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel TSX-NI | Yes |
| Intel 64 | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel TSX-NI version | 1.00 |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Optane™ Memory Ready | No |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Tcase | 70 °C |
| Tjunction | 85 °C |
| Processor cache | 39424 KB |
| Product type | Processor |
| Supported memory types | DDR4-SDRAM |
| Harmonized System (HS) code | 85423119 |
| Package width | 104 mm |
| Package depth | 130 mm |
| Package height | 45 mm |
| Package weight | 322 g |
| Package type | Retail box |
| Processor package size | 76mm x 56.5mm |
| Maximum internal memory | 512 GB |
| Maximum internal memory | 524288 MB |
| Bus bandwidth | 8 |
| Bus type units | GT/s |
| Launch date | Q4'18 |
| Status | Launched |
| Maximum memory | 512 GB |
| Processor brand name | Intel Xeon |
| Last change | 63903513 |
| Product family | Intel Xeon Processors |
| Intel® Speed Shift Technology version | 1.00 |
| Intel® Volume Management Device (VMD) version | 1.00 |
| Memory speed (max) | 2666 MHz |
| Bus speed | 8 GT/s |
| Servicing status | Baseline Servicing |
| End of servicing updates date | Sunday, December 31, 2023 |
| Description |
| Intel Xeon W-3175X. Processor family: Intel® Xeon®, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 512 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Desktop, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 1S. Package width: 104 mm, Package depth: 130 mm, Package height: 45 mm. Processor package size: 76mm x 56.5mm |
